We specialise in the assembly of Printed Circuit Boards. Our facilities include equipment and expertise for assembly of both surface mount and through-hole printed circuit boards, as well as boards using a combination of these technologies.
Assembled boards are individually checked for defects before being provided to clients.
Surface Mount Technology (SMT) Assembly
SMTs are assembled using a high-precision pick and place production line, consisting of a paste solder printer, pick and place machines and a reflow oven. The production line has a capacity of up to 60 000 of chips per hour and placement accuracy of <50 µm, with minimum component sizes of 0201 (2 mm x 1 mm).
Assembly can be done according to client specifications, including ROHS compliance and all boards are quality checked after assembly.
Through-Hole (thru-hole) Board Assembly
Through-hole boards are assembled manually and soldered with in-house wave soldering machines. To maintain quality, manual soldering is done for components that are not suitable for wave soldering. All boards are individually checked for production defects.